A novel ultra-thin vapor chamber with radial-gradient hierarchical wick for high-power electronics cooling
Feng Zhou, Guohui Zhou, Jingzhi Zhou, Xiulan Huai, Yawen Jiang
Topics & Concepts
Materials scienceHeat transferThermal resistanceMiniaturizationTemperature gradientWater coolingCoaxialElectronicsThermal conductivityHeat sinkHeat transfer coefficientElectronics coolingMechanical engineeringMechanicsNuclear engineeringComposite materialElectrical engineeringNanotechnologyMeteorologyPhysicsEngineeringHeat Transfer and Boiling StudiesHeat Transfer and OptimizationSpacecraft and Cryogenic Technologies