Bonding and strengthening mechanism on ultrasonic-assisted soldering of sapphire using Sn-3.5Ag-4Al solder
Yan Xu, Xinran Ma, Ziyang Xiu, Jiuchun Yan
Topics & Concepts
Materials scienceSapphireSolderingAmorphous solidComposite materialShear strength (soil)Layer (electronics)MicrostructureMetallurgyCrystallographyOpticsChemistrySoil scienceEnvironmental scienceSoil waterLaserPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis