Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying
Tangkui Zhu, Qingke Zhang, Hailong Bai, Lingyan Zhao, Jikang Yan
Topics & Concepts
Materials scienceSolderingIntermetallicUltimate tensile strengthMetallurgyMicrostructureJoint (building)Composite materialIndentation hardnessGrain sizeLayer (electronics)AlloyArchitectural engineeringEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties