Litcius/Paper detail

Integration of boron arsenide cooling substrates into gallium nitride devices

Joon Sang Kang, Man Li, Huan Wu, Huuduy Nguyen, Toshihiro Aoki, Yongjie Hu

2021Nature Electronics141 citationsDOI

Topics & Concepts

Materials scienceGallium arsenideOptoelectronicsThermal conductivityGallium nitrideWide-bandgap semiconductorSemiconductorBand gapBoron nitrideDiamondGallium phosphideNanotechnologyComposite materialLayer (electronics)Thermal properties of materialsGaN-based semiconductor devices and materialsAdvancements in Semiconductor Devices and Circuit Design
Integration of boron arsenide cooling substrates into gallium nitride devices | Litcius