Intensified chipping during nanoindentation and the effect of friction on the interfacial fracture for thin films used in N/MEMS
Ritambhara Dash, Kushal Bhattacharyya, Ramagiri Praveen Kumar, A. S. Bhattacharyya
Abstract
Abstract Nanoindentation was performed on Ti-B-Si-C and SiCN films deposited on Si substrates at varying loads and depths of penetrations. The intensity of chipping got enhanced with an increasing load which was represented geometrically. The pop-in and pop-out events occurring in the load and unloading were explained as cracking and high-pressure phase transformation. The interfacial fracture stability and adhesion of the film-substrate system, crucial for N/MEMS devices were analyzed with respect to frictional coefficient with the help of Finite Element Modelling (FEM).
Topics & Concepts
NanoindentationMaterials scienceMicroelectromechanical systemsComposite materialFinite element methodThin filmSubstrate (aquarium)CrackingFracture (geology)AdhesionPhase (matter)NanotechnologyStructural engineeringOceanographyEngineeringGeologyOrganic chemistryChemistryMetal and Thin Film MechanicsDiamond and Carbon-based Materials ResearchAdvanced Surface Polishing Techniques