Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain
Kun Zhang, Zhen Yin, Chenwei Dai, Qing Miao, Peng Zhang, Ziyang Cao
Topics & Concepts
Materials scienceGrindingComposite materialCeramicChip formationGrain sizeChipDiamondSpecific energyGrinding wheelMetallurgyTool wearMachiningQuantum mechanicsEngineeringPhysicsElectrical engineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationTunneling and Rock Mechanics