Improving dimensional stability at high temperature and toughness of polyimide films via adjustable entanglement density
Yi Jiang, Changyao Liu, Yiyao Tian, Ke Wang, Xiangyang Liu, Longbo Luo
Topics & Concepts
ToughnessThermal expansionPolyimideMaterials scienceQuantum entanglementGlass transitionThermal stabilityPolymerComposite materialChemical engineeringQuantumLayer (electronics)PhysicsQuantum mechanicsEngineeringSynthesis and properties of polymersEpoxy Resin Curing ProcessesTribology and Wear Analysis