Litcius/Paper detail

Substrate RF Losses and Non-linearities in GaN-on-Si HEMT Technology

Sachin Yadav, Pieter Cardinael, Ming Zhao, Komal Vondkar, Ahmad Khaled, R. Rodríguez, Bjorn Vermeersch, S. Makovejev, Enriqué Ekoga, A. Pottrain, Niamh Waldron, J-P. Raskin, Bertrand Parvais, Nadine Collaert

202021 citationsDOIOpen Access PDF

Abstract

The analysis and mitigation of substrate-related RF losses and non-linearities is crucial to enable GaN HEMTs on silicon for front-end transceivers for 5G and beyond. Here, for the first time, the impact of material growth and HEMT fabrication process on the substrate RF losses and linearity is studied using the effective substrate resistivity, ρ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eff</inf> , and 2 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">nd</sup> harmonic power, H2, figures-of-merit. It is shown that CPWs on fully-processed, GaN-on-high resistivity (3-6 kΩ•cm), 200 mm CZ-Si wafers can achieve H2 levels ~ -85 dBm (at P <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">out</inf> ~15 dBm) with ρ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eff</inf> ~1 kΩ•cm.

Topics & Concepts

High-electron-mobility transistorSubstrate (aquarium)WaferMaterials scienceGallium nitrideOptoelectronicsFabricationFigure of meritSiliconRadio frequencyElectrical engineeringNanotechnologyTransistorEngineeringBiologyMedicinePathologyAlternative medicineEcologyVoltageLayer (electronics)GaN-based semiconductor devices and materialsRadio Frequency Integrated Circuit DesignGa2O3 and related materials