Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems
Trevor Michael Braun, D. Josell, Thomas P. Moffat
Topics & Concepts
ElectrolytePassivationElectrodeVoid (composites)Ohmic contactHalideMaterials scienceMetalContact resistanceChemistryComposite materialAnalytical Chemistry (journal)Layer (electronics)MetallurgyInorganic chemistryPhysical chemistryChromatographyElectrodeposition and Electroless CoatingsElectrochemical Analysis and ApplicationsElectrocatalysts for Energy Conversion