Solid-State Qubits: 3D Integration and Packaging
Danna Rosenberg, Steven Weber, David Conway, D. Yost, Justin Mallek, Gregory Calusine, Rabindra Nath Das, David Kim, Mollie E. Schwartz, Wayne Woods, Jonilyn Yoder, William D. Oliver
Abstract
Quantum processing has the potential to transform the computing landscape by enabling efficient solutions to problems that are intractable using classical processors. The field was sparked by a suggestion from physicist Richard Feynman in 1981 that a controllable quantum system can be used to simulate other quantum systems, such as the energy band structure of complex materials or the chemical reaction rates of intricate molecules. In the 1990s, interest in quantum computing grew rapidly with the introduction of the first quantum "killer app"-the potential of a large-scale quantum processor to break certain types of public encryption schemes [1]. Recently, there has been growing consensus that myriad other fields besides data security could be impacted by the development of a quantum processor, including machine learning [2], many optimization problems [3], and Feynman's original idea of the simulation of materials properties [4]. In recent years, the field has progressed rapidly, but many technical challenges must be overcome before a large-scale quantum processor can be built. This article focuses on the development of packaging for solid-state qubits and the use of 3D integration to address this challenge.