Evolution of microstructure and properties of an ultrahigh strength Cu–Ni–Sn alloy with low Sn content during the multi-stage thermomechanical treatment
Yufang Zhang, Xueping Gan, Zhu Xiao, Yanlin Jia, Wenting Qiu, Xiangpeng Meng, Yi Zhang, Lairong Xiao, Gai Sun, Tianyi Zhang
Topics & Concepts
Materials scienceAlloyMicrostructurePrecipitationUltimate tensile strengthMetallurgyPrecipitation hardeningDeformation (meteorology)Electrical resistivity and conductivityComposite materialEngineeringMeteorologyElectrical engineeringPhysicsAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesSemiconductor materials and interfaces