A Review of Die-to-Die, Die-to-Substrate and Die-to-Wafer Heterogeneous Integration

Abstract

This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-to-substrate integration for advanced packaging. Key D2D and D2W integration approaches such as solder flip-chip, solderless thermal compression bonding, and copper/dielectric hybrid bonding, are identified and analyzed. For each method, the underlaying mechanism, influencing factors, challenges, and state of the art implementations are discussed. Additionally, these methods are compared based on mechanical and electrical reliability studies from the literature to delineate the design space for their application in advanced packaging.

Topics & Concepts