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Understanding the machining characteristic of plain weave ceramic matrix composite in ultrasonic-assisted grinding

Menghua Zhang, Zixuan Pang, Yunxiang Jia, Chenwei Shan

2021Ceramics International110 citationsDOI

Topics & Concepts

Materials scienceGrindingComposite materialMachiningSilicon carbideSurface roughnessBrittlenessBreakageSurface integrityCeramicCeramic matrix compositeUltrasonic sensorUltrasonic machiningComposite numberFracture (geology)Surface finishMetallurgyPhysicsAcousticsAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesTunneling and Rock Mechanics
Understanding the machining characteristic of plain weave ceramic matrix composite in ultrasonic-assisted grinding | Litcius