3D Multimodal Sensing and Feedback Finger Case for Immersive Dual‐Way Interaction
Tao Chen, Zhiwei Dai, Ming Liu, Yudong Zhao, Hao Ling, Lining Sun, Haidong He, Chengkuo Lee, Minglu Zhu
Abstract
Abstract With the rapid development of virtual reality (VR) technology, artificial intelligence , and the Internet of Things , a new era of immersive interaction with the digital world has emerged. In this context, a novel soft finger case with 3D multi‐modal sensing and feedback functions (3D‐SFC) is presented. The device leverages multiple material properties to create a modulated fingertip haptic feedback for the perception of orientation and force, triboelectric nanogenerator (TENG) sensing with dynamic and static responses and control of movement, and thermal feedback based on resistive heating of TENG electrodes. The integrated TENG tactile sensing unit in the device is capable of recognizing the texture of an object's surface, providing users with a more natural and intuitive way of interacting with digital objects. The spatial consistency of multi‐modal sensing and feedback enhances human‐machine interaction in various fields such as healthcare, manufacturing and assembly, and gaming, etc. The proposed device represents a new intelligent sensing solution for achieving cross‐space sensory interaction, opening up new possibilities for the future of VR and digital interaction.