Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications
Omid Mokhtari, Hiroshi Nishikawa
Topics & Concepts
IntermetallicCorrosionGalvanic cellKelvin probe force microscopeMaterials scienceAnodeMetallurgyGalvanic corrosionPotential differenceCopperWire bondingVolta potentialAtomic force microscopyChemistryNanotechnologyElectrodeElectrical engineeringPhysical chemistryEngineeringAlloyChipElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties