Computational and experiments exploration of convection on Cu filling characteristics of multiple aspect-ratio micro through-holes
Qing Wang, Jiaxin Liu, Zhenyu Lei, Yun Mou, Mingxiang Chen
Topics & Concepts
ConvectionAdsorptionElectroplatingMaterials scienceForced convectionNatural convectionFlow (mathematics)Aspect ratio (aeronautics)MechanicsChemistryNanotechnologyComposite materialPhysicsLayer (electronics)Organic chemistryElectrodeposition and Electroless CoatingsAnodic Oxide Films and NanostructuresNanofabrication and Lithography Techniques