Additive manufacturing of steel–copper functionally graded material with ultrahigh bonding strength
Chaolin Tan, Youxiang Chew, Guijun Bi, Di Wang, Wenyou Ma, Yongqiang Yang, Kesong Zhou
Topics & Concepts
Materials scienceBonding strengthPorosityComposite materialBond strengthCopperFusionReliability (semiconductor)MetallurgyLayer (electronics)PhysicsLinguisticsPhilosophyPower (physics)AdhesiveQuantum mechanicsAdditive Manufacturing and 3D Printing TechnologiesAdditive Manufacturing Materials and ProcessesAluminum Alloys Composites Properties