Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
P. Roumanille, Emna Ben Romdhane, S. Pin, Patrick Nguyen, Jean-Yves Delétage, A. Guédon-Gracia, H. Frémont
Topics & Concepts
Materials scienceSolderingBall grid arrayIsothermal processTemperature cyclingIntergranular corrosionMetallurgyCrackingCoalescence (physics)Composite materialAlloyThermalMeteorologyAstrobiologyPhysicsThermodynamicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties