In-situ temperature-dependent characterization of copper through glass via (TGV)
Ke Pan, Jiefeng Xu, Yangyang Lai, Seungbae Park, Chukwudi Okoro, Dhananjay Joshi, Scott Pollard
Topics & Concepts
Materials scienceCopperInterposerCreepComposite materialTemperature cyclingDeformation (meteorology)Stress (linguistics)ThermalMetallurgyLayer (electronics)ThermodynamicsLinguisticsEtching (microfabrication)PhysicsPhilosophy3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies