Litcius/Paper detail

Excellent mechanical properties and high electrical conductivity of Cu-Co-Si-Ti alloy due to multiple strengthening

Yongfeng Geng, Yijie Ban, Xu Li, Yi Zhang, Yanlin Jia, Baohong Tian, Meng Zhou, Yong Liu, Alex A. Volinsky, Kexing Song, Shunlong Tang

2021Materials Science and Engineering A39 citationsDOI

Topics & Concepts

Materials scienceAlloyMicrostructureElectrical resistivity and conductivityElectron backscatter diffractionMetallurgyTexture (cosmology)Ultimate tensile strengthCopperBrassVolume fractionStrengthening mechanisms of materialsComposite materialElectrical engineeringEngineeringImage (mathematics)Computer scienceArtificial intelligenceMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties
Excellent mechanical properties and high electrical conductivity of Cu-Co-Si-Ti alloy due to multiple strengthening | Litcius