Quasi-in-situ observation of microstructure evolution and growth kinetics analysis of Sn 58Bi solder under different aging conditions
Junjie Zhao, Hongshun Gong, Hao Wang, Mingqing Liao, Fengjiang Wang
Topics & Concepts
Materials scienceMicrostructureSolderingIn situKineticsMetallurgyComposite materialPhysicsMeteorologyQuantum mechanicsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesIntermetallics and Advanced Alloy Properties