Advanced Packaging
John H. Lau
Topics & Concepts
Scope (computer science)Packaging engineeringIntegrated circuit packagingElectronic packagingEngineeringManufacturing engineeringComputer scienceMechanical engineeringElectrical engineeringIntegrated circuitProgramming language3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability