Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer
Wei Jian, Hanbin Yin, Ying Chen, Xue Feng
Topics & Concepts
WaferMaterials scienceDelamination (geology)CrackingComposite materialInterface (matter)Thin filmWafer bondingStructural engineeringOptoelectronicsNanotechnologyEngineeringGeologyCapillary numberSubductionCapillary actionTectonicsPaleontologyAdvanced Surface Polishing TechniquesElectronic Packaging and Soldering TechnologiesAdvancements in Photolithography Techniques