Litcius/Paper detail

A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

Yongjia Wu, Sen Chen, Tingrui Gong, Tianhao Shi, Lei Zuo, Yonggao Yan, Yueping Fang, Tingzhen Ming

2022Journal of Thermal Science10 citationsDOIOpen Access PDF

Topics & Concepts

TECThermoelectric coolingMaterials scienceThermoelectric effectTransient (computer programming)Thin filmOptoelectronicsChipSemiconductorHeat fluxNuclear engineeringElectrical engineeringMechanicsComputer scienceHeat transferThermodynamicsNanotechnologyEngineeringPhysicsIonosphereOperating systemAstronomyAdvanced Thermoelectric Materials and DevicesThermal properties of materialsThermal Radiation and Cooling Technologies
A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler | Litcius