A curing agent for epoxy resin based on microencapsulation of 1-butylimidazole
Binghong Zhang, Aijie Ma, Jiaoyang Li, Siyu Xiao, Chunmei Li, Weifeng Zhao, Gai Zhang, Hongli Zhang
Topics & Concepts
EpoxyCuring (chemistry)Materials scienceTrimethylolpropaneEmulsionChemical engineeringComposite materialParticle sizePolyurethaneEngineeringEpoxy Resin Curing ProcessesPhotopolymerization techniques and applicationsSynthesis and properties of polymers