Litcius/Paper detail

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Haksan Jeong, Kwang‐Ho Jung, Choong-Jae Lee, Kyung Deuk Min, Woo‐Ram Myung, Seung‐Boo Jung

2020Journal of Materials Science Materials in Electronics24 citationsDOI

Topics & Concepts

Materials scienceComposite materialFan-outEpoxyMoldThermal expansionChip-scale packageWaferFinite element methodStructural engineeringEngineeringOptoelectronics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package | Litcius