Numerical feasibility study of using ultrasonic surface vibration as a new technique for thermal management of the electronic devices
Amin Shahsavar, Hossein Ghazizade–Ahsaee, Ighball Baniasad Askari, Milad Setareh
Topics & Concepts
VibrationPressure dropHeat transfer coefficientHeat sinkMaterials scienceHeat transferUltrasonic sensorTransducerThermalInletAcousticsReynolds numberFinBase (topology)Thermal resistanceComposite materialMechanical engineeringMechanicsEngineeringThermodynamicsPhysicsTurbulenceMathematicsMathematical analysisHeat Transfer MechanismsHeat Transfer and OptimizationNanofluid Flow and Heat Transfer