Long-Term Temperature-Dependent Degradation of 175 W Chip-on-Board LED Modules
Alexander Herzog, Max Wagner, Simon Benkner, Babak Zandi, W.D. van Driel, Tran Quoc Khanh
Abstract
We report on the degradation dynamics and mechanisms of the commercially available chip-on-board (COB) high-power light-emitting diode (LED) modules with an electrical power of 175 W. Due to the associated thermal load, the temperature dependence of the aging processes is additionally analyzed within the scope of this work. The aging tests were performed for a period of 6000 h at four different case temperatures between 55 °C and 120 °C. The results of the accelerated stress tests indicate a temperature-activated aging process, which severely limits the lifetime of the modules. In addition, the following key findings can be reported: 1) a significant decrease in optical power occurs within 6000 h of operation; 2) depending on the stress test condition the accompanying color shifts exceed a limit of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\Delta {u}\,'{v}\,'={0}.{007}$ </tex-math></inline-formula> ; and 3) the limiting degradation mechanism can be attributed to the package of the device and can be accelerated with temperature, current, and chemicals. Reported findings can be manifested by additional optical material inspections, allowing to use the results for optimizations of future module generations.