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Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps

Farough Roustaie, Sebastian Quednau, Florian Weissenborn, Olav Birlem

2021Journal of Materials Engineering and Performance16 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceFlip chipNanowireWafer dicingContact resistanceInterconnectionDiffusion bondingWire bondingThermal copper pillar bumpComposite materialThermocompression bondingOptoelectronicsWaferLayer (electronics)ChipAdhesiveElectrical engineeringEngineeringComputer networkComputer science3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography Techniques
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