Effect of integrated copper pad on the performance of boiling-driven wickless thermal ground plane
Joo Hyun Moon, Xiaomeng Wang, Dani Fadda, Dong Hwan Shin, Jungho Lee, Seung M. You
Topics & Concepts
CopperMaterials scienceThermal conductivityBoilingThermal conductionComposite materialThermalHeat transferNucleate boilingBoiling pointHeat fluxThermodynamicsMechanicsMetallurgyPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationHeat and Mass Transfer in Porous Media