X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5
Ke Li, Linhai Xu, Lei Su, Jiefei Gu, Yong Ji, Gang Wang, Xuefei Ming
Topics & Concepts
ChipSolderingCeramicBlock (permutation group theory)Intersection (aeronautics)Computer scienceChip-scale packageMaterials scienceElectronic engineeringEngineeringComposite materialTelecommunicationsMathematicsGeometryAerospace engineeringIndustrial Vision Systems and Defect DetectionAdvanced Neural Network ApplicationsThermography and Photoacoustic Techniques