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Numerical solutions of hypersingular integral equations for stress intensity factors of planar embedded interface cracks and their correlations with bimaterial parameters

Hao Chai, Jun Lv, Yumei Bao

2020International Journal of Solids and Structures12 citationsDOI

Topics & Concepts

Stress intensity factorPlanarIntegral equationMathematicsStress (linguistics)Mathematical analysisDisplacement (psychology)Interface (matter)Fracture (geology)Intensity (physics)Numerical analysisFinite element methodMaterials scienceFracture mechanicsGeometryStructural engineeringComposite materialPhysicsOpticsComputer scienceEngineeringPsychologyPsychotherapistCapillary actionPhilosophyComputer graphics (images)Capillary numberLinguisticsNumerical methods in engineeringGeotechnical Engineering and Underground StructuresFatigue and fracture mechanics
Numerical solutions of hypersingular integral equations for stress intensity factors of planar embedded interface cracks and their correlations with bimaterial parameters | Litcius