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Towards understanding the mechanism of vibration-assisted cutting of monocrystalline silicon by cyclic nanoindentation

Weihai Huang, Jiwang Yan

2022Journal of Materials Processing Technology31 citationsDOI

Topics & Concepts

NanoindentationBrittlenessMaterials scienceIndentationMonocrystalline siliconSiliconMicrostructureComposite materialDeformation (meteorology)Chip formationMetallurgyTool wearMachiningAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationMetal and Thin Film Mechanics
Towards understanding the mechanism of vibration-assisted cutting of monocrystalline silicon by cyclic nanoindentation | Litcius