Mechanisms underlying temperature uniformity in electrostatic chucks through experimental and simulation methods
Chanjuan Liu, Jiuru Gao, Zhiwei He, Kang Han, Zhen Yang, Kaidong Xu, Shiwei Zhuang
Topics & Concepts
Reliability (semiconductor)Materials scienceWaferClampingMechanicsMechanical engineeringCoolantSemiconductorWork (physics)OptoelectronicsElectronic engineeringNuclear engineeringEngineeringThermodynamicsPhysicsPower (physics)Electrostatic Discharge in ElectronicsPlasma Diagnostics and ApplicationsElectrohydrodynamics and Fluid Dynamics