Litcius/Paper detail

Research progress of residual stress measurement methods

Xuewen Li, Jiwei Liu, Hao Wu, Kesong Miao, Wu He, Rengeng Li, Chenglu Liu, Wen-bin FANG, Guohua Fan

2024Heliyon46 citationsDOIOpen Access PDF

Abstract

Residual stress refers to self-equilibrating stress present within materials, with the potential to significantly affect manufacturing processes and performance. Therefore, accurately and quantitatively measuring residual stress is always of great importance. This study provides a comprehensive review of various characterization techniques for residual stress, including their principles, development history, applications, and limitations. Initially, several destructive techniques such as the hole-drilling method, ring-core method, deep hole drilling method, slitting method, and contour method are summarized. Subsequently, three nondestructive techniques based on X-ray/electron diffraction, magnetic signals, and ultrasonic signals are evaluated. In the final part of this overview, special attention is given to a newly-developed technique for measuring residual stress, which combines incremental focused ion beam (FIB) milling and digital image correlation (DIC). Our review aims to guide further investigations on residual stress and identify the future development of techniques for measuring residual stress.

Topics & Concepts

Residual stressResidualStress (linguistics)Materials scienceComputer scienceHole drilling methodCharacterization (materials science)NanotechnologyMetallurgyAlgorithmLinguisticsPhilosophyWelding Techniques and Residual StressesAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure Analysis