Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
Yuliang Zhang, Xiaozhu Xie, Yaoan Huang, Wei Hu, Jiangyou Long
Topics & Concepts
SlicingMaterials scienceWaferSilicon carbideLaserUltrashort pulseCarbideSiliconOptoelectronicsEngineering physicsMetallurgyOpticsMechanical engineeringEngineeringPhysicsAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesIntegrated Circuits and Semiconductor Failure Analysis