SiO2-SiO2 die-to-wafer direct bonding interface weakening
Toshiyuki Tabata, Loïc Sanchez, Vincent Larrey, Frank Fournel, H. Moriceau
Topics & Concepts
Anodic bondingWafer bondingDirect bondingAnnealing (glass)Materials scienceWaferThermocompression bondingDiffusion bondingWire bondingNanotechnologyComposite materialLayer (electronics)Electrical engineeringChipEngineering3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques