Litcius/Paper detail

Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach

Hisashi Matsumoto, Zhibin Lin, Joel N. Schrauben, Jan Kleinert, Rodrigo Gómez Vázquez, Michele Buttazzoni, Andreas Otto

2022Applied Physics A18 citationsDOI

Topics & Concepts

Materials scienceLaserLaser drillingOpticsOptoelectronicsDiodePhysicsLaser Material Processing TechniquesSemiconductor Lasers and Optical DevicesAdvanced Surface Polishing Techniques
Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach | Litcius