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Enabling contactless rapid on-demand debonding and rebonding using hysteresis heating of ferrimagnetic nanoparticles

Xinying Cheng, Yang Zhou, Andrew D.M. Charles, Yuyan Yu, Mohammad S. Islam, Shuhua Peng, John Wang, Andrew N. Rider, May Lim, Victoria Timchenko, Chunhui Wang

2021Materials & Design27 citationsDOIOpen Access PDF

Abstract

Rapid and contactless on-demand debonding and rebonding of high-strength joints is a promising solution for quick attachment, repairs, disassembly, and recycling of structural systems. Herein we show that rapid and contactless on-demand debonding and rebonding can be achieved by incorporating ferrimagnetic iron oxide nanoparticles (Fe 3 O 4 ) into poly(ethylene-methacrylic acid) (EMAA). When subjected to an external alternating magnetic field, the ferrimagnetic nanoparticles generate localized heat which melt the EMMAA, resulting in quick (<1 min) debonding and rebonding. The strength of the adhesive bond matches that achieved by conventional oven heating, exceeding the highest value reported for reversible adhesives in the literature. The results also show that, for the first time, the ferrimagnetic nanoparticles are effective in retaining 100% of the original bond strength for up to five cycles of repeated debonding and rebonding. Analytical and computational models have been developed to characterize the effects of key design parameters, such as Fe 3 O 4 mass loading and magnetic flux on the heating performance and bond strength. The model correlates well with experimental results and reveals that magnetic hysteresis loss is more efficient than eddy current generated by conductive fillers for heating the adhesive. The high-strength EMAA/Fe 3 O 4 adhesive is a very promising solution for contactless, on-demand, repeated adhesion applications to complex geometries and in hard-to-access locations.

Topics & Concepts

FerrimagnetismMaterials scienceComposite materialNanoparticleAdhesiveHysteresisNanotechnologyMagnetic fieldMagnetizationCondensed matter physicsQuantum mechanicsLayer (electronics)PhysicsSurface Modification and SuperhydrophobicityPolymer Nanocomposites and PropertiesAdvanced Materials and Mechanics