Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints
Ruiqian Zheng, Wenqian Li, Mengxuan Cheng, Hao Zheng, Zhiyan Zhao, Guoshun Wan, Yuxi Jia
Topics & Concepts
Finite element methodSolderingTemperature cyclingStructural engineeringScale (ratio)Thermal fatigueEngineeringThermalForensic engineeringMaterials scienceComposite materialPhysicsQuantum mechanicsMeteorologyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesMetallurgy and Material Forming