Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
Vishnu Kant Bajpai, Dileep Kumar Mishra, Pradeep Dixit
Topics & Concepts
Materials scienceMicrostructureAnnealing (glass)FabricationComposite materialScanning electron microscopeMicroelectromechanical systemsLithographyMicrofabricationLayer (electronics)NanotechnologyOptoelectronicsPathologyAlternative medicineMedicineElectrodeposition and Electroless Coatings3D IC and TSV technologiesCopper Interconnects and Reliability