Mechanical behaviors of lotus-type porous Cu/Cu joint soldered by Sn-3.0Ag-0.5Cu alloy
Sang‐Wook Kim, Kwangtae Son, Soong‐Keun Hyun
Topics & Concepts
Materials scienceSolderingJoint (building)PorosityLotusComposite materialIntermetallicDuctility (Earth science)Ultimate tensile strengthShear strength (soil)MicrostructureAlloyMetallurgyStructural engineeringCreepEnvironmental scienceBotanyEngineeringSoil scienceBiologySoil waterAluminum Alloys Composites PropertiesCellular and Composite StructuresMetal Forming Simulation Techniques