Warping model of high-power IGBT modules subjected to reflow soldering process
Shang Gao, Rongliang Wang, Haoxiang Wang, Renke Kang
Topics & Concepts
Insulated-gate bipolar transistorSolderingMaterials scienceReflow solderingImage warpingResidual stressProcess (computing)Mechanical engineeringFinite element methodPower (physics)Electronic engineeringComposite materialStructural engineeringEngineeringComputer sciencePhysicsQuantum mechanicsArtificial intelligenceOperating systemElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesAluminum Alloys Composites Properties