Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient
Yanqing Lai, Shi Chen, Xiaolei Ren, Yuanyuan Qiao, Ning Zhao
Topics & Concepts
Materials scienceIntermetallicVoid (composites)Morphology (biology)Composite materialMetallurgyAlloyGeneticsBiologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAdvanced Welding Techniques Analysis