Study on a novel fixed and free abrasive combined wire sawing multi-crystalline silicon wafers for wet acid texturization
Runtao Liu, Yufei Gao, Dameng Cheng, Tianzhao Pu
Topics & Concepts
WaferMaterials scienceAbrasiveSlicingWafer dicingDiamondSiliconPolishingComposite materialChemical-mechanical planarizationLappingSurface finishSurface roughnessEtching (microfabrication)OptoelectronicsMechanical engineeringLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesSilicon and Solar Cell TechnologiesNanowire Synthesis and Applications