A machine learning and finite element simulation-based void inspection for higher solder joint reliability
Kaiyuan Chen, Yu Zhang, Yu Zhang, Guang Cheng, Yang Zhang, Yang Zhang
Topics & Concepts
Finite element methodSolderingVoid (composites)Joint (building)Reliability (semiconductor)Structural engineeringReliability engineeringComputer scienceMechanical engineeringEngineeringMaterials scienceComposite materialPhysicsQuantum mechanicsPower (physics)Electronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure AnalysisAluminum Alloy Microstructure Properties