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MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks

Yu-Wei Chen, Jia-Fan Kuo, Yi-Chen Wang, Chung-Wei Cheng

2026CIRP journal of manufacturing science and technology6 citationsDOI

Topics & Concepts

SlicingMaterials scienceWaferUltimate tensile strengthSilicon carbideFemtosecondSurface finishComposite materialSurface roughnessLaserCarbideSiliconOpticsEnergy (signal processing)Crystal (programming language)Work (physics)Orientation (vector space)OptoelectronicsHigh energyMonocrystalline siliconResidual stressLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesSilicon Carbide Semiconductor Technologies
MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks | Litcius