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Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

Choong-Jae Lee, Dong-Gil Kang, Byeong-Uk Hwang, Kyung Deuk Min, Jinho Joo, Seung‐Boo Jung

2021Journal of Alloys and Compounds14 citationsDOI

Topics & Concepts

Materials scienceMicrostructureSinteringNucleationElectrochemistryComposite materialSubstrate (aquarium)Chemical engineeringMetallurgyElectrodeChemistryOrganic chemistryEngineeringGeologyOceanographyPhysical chemistryNanomaterials and Printing TechnologiesThin-Film Transistor TechnologiesZnO doping and properties
Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior | Litcius