Connection reinforcement design of ODS-W/Cu joint: Transforming immiscible interface into dual reaction diffusion interface
Dang Xu, Pengqi Chen, Kaichao Fu, Changcheng Sang, Ruizhi Chen, Tao Hong, Jigui Cheng, Kai Xu
Topics & Concepts
Materials scienceInterface (matter)Connection (principal bundle)DiffusionDual (grammatical number)Joint (building)Composite materialMechanical engineeringStructural engineeringThermodynamicsWettingArtEngineeringPhysicsSessile drop techniqueLiteratureCopper Interconnects and ReliabilityElectronic Packaging and Soldering TechnologiesMetal and Thin Film Mechanics