Litcius/Paper detail

Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

Dae Young Park, Jung Soo Kim, Dong-Yurl Yu, Sehoon Yoo, Hyunsoon Park, Yoonchul Sohn, Yong-Ho Ko

2021Journal of Materials Science Materials in Electronics11 citationsDOI

Topics & Concepts

Kirkendall effectMaterials scienceSolderingMicrostructureIntermetallicMetallurgyEutectic systemComposite materialAlloyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies
Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction | Litcius